Category Archives: Industrial pc

Acrosser revealed its Vortex86DX3 processor fan-less ISA Half-Size single board computer

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Today, acrosser Technology announced its fan-less ISA Half-Size single board computer, AMB-VDX3H1, based upon the ultra-low power Vortex86DX3 processor with wired networking capability.

Acrosser AMB-VDX3H1 is a fan-less ISA Half-Size SBC with PC/104 & ISA Interface featuring the latest generation DM&P® Vortex86DX3® SOC processor with Onboard DDR3 512MB to 1GB SDRAM and 1 xRJ45 10/100 Mbps LAN.

The AMB-VDX3H1 offers full and legacy ISA bus following PC/104 2.6 specifications, and supports IDE, SATA, and CF card storage. The SBC is equipped with VGA(DB15) along with 4 USB 2.0 ports, two RS-232/422/485 serial ports, and two RS232 serial ports. There’s also 1 PS/2 port, 1 JST connector, 1 PC/104 Expansion Slot and 1 ISA golden finger.

Specifications for the AMB-VDX3H1 include:

  • Onboard DM&P Vortex86DX3 800MHz 1GHz dual-core
  • Onboard 1GB DDR3 SDRAM
  • PC/104 & ISA Interface
  • 4 x COM, 4 x USB 2.0, VGA, 1 xRJ45 10/100 Mbps LAN
  • IDE, CF, SATA storage.
  • Operating Temp. 0~60oC (32 ~140oF)

Acrosser AMB-VDX3H1 is a fan-less, small size, low power, rugged-design single board computer which is the best solution for embedded systems in the industrial control, industrial automation, factory automation, transportation, Mil/COTS, telecommunication, instrumentation, CNC machines, MMI, HMI(Human Machine Interface), CTI (Computer Telephony Integration), DVR (Digital Video Recorder), machine tools applications.

For more information about AMB-VDX3H1. please go to our online inquiry sysyem:http://www.acrosser.com/inquiry.html

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Fanless embedded pc, EPIC Board, Micro Box, PCI104 I/O Module,

car computer,

Acrosser Announced New Apollo Lake Network Appliances: AND-APL1N1FL

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In order to provide customer more choices in entry-level network solution, today acrosser Technology, a world-leading network appliance supplier, proudly revealed its latest micro box fan-less network appliance –AND-APL1N1FL series.

The fan-less micro box network appliance, AND-APL1N1FL, can offer the UTMost connectivity with a compact form factor at dimensions 280 x 209 x 44 mm (11.02” x 8.23” x 1.73”). In addition, AND-APL1N1FL also supports 3-pair LAN bypass for Ethernet connection and provides a luxurious set of I/O, including one mini PCIe slot to support WiFi or 4G, three USB3.0 ports on the rear panel, one console port (RJ45), 8-bit GPIO on-board pin header, and one SATA III port or mSATA socket. Rich I/O ports and drive bays are designed for easy access and maintenance.

AND-APL1N1FL, with compact size and reasonable cost, is the perfect solution for small office network solution, UTM, mail server and firewall applications.

AND-APL1N1FL Specifications:

  1. Intel® Apollo Lake SoC J-series/N-series/E-series
  2. 1 x SO-DIMM DDR3L-1866 MHz, up to 8GB
  3. 6 x GbE, 3 x USB
  4. 1 x Mini PCIe Socket
  5. 8 x GPIO

Product introduction video please refers to:

https://www.youtube.com/watch?v=1JymTQfSXsY&feature=youtu.be

This new Apollo Lake network appliance: AND-APL1N1FL is designed with customers looking for a cost-effective niche solution in mind. Samples are available upon request; please contact us via the online inquiry system:

http://www.acrosser.com/inquiry.html

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Network Application, COM Express, car pc, Embedded pc, Embedded board,

Acrosser is able to directly obtain valuable resources in providing high quality and stable performance products/solutions to its customers, vis-à-vis non-IoT-Alliance-members.

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acrosser Technology latest network appliance, AND-DNV3N2, which equipped with Intel® Atom C3558 Denverton-NS Platform and 2x SO-DIMM DDR4, 6x GbE, 2x USB 3.0, 2x Mini PCIe(One support SIM card socket),1x 2.5″ SSD and TPM 2.0 for a secure cryptoprocessor. This optimized system design allows network systems to function in a small footprint and form factor. In this particular size, the AND-DNV3N2 is a great alternative for the budget-conscious buyers. This cost-effective network security appliance can offer stable performance with low power consumption; and is suitable in multiple security applications including: network intrusion prevention, content filtering, data leak prevention, VPN, unified threat management (UTM) and SD-WAN solutions.

Major AND-DNV3N2 Specification:
1.Intel® Atom C3558 Denverton-NS Platform
2. 4-Core SoC
3. 2x SO-DIMM DDR4
4. 6x GbE, 2x USB 3.0
5. 2x Mini PCIe, One support SIM card socket
6. 1x 2.5″ SSD,
7. TPM 2.0

AND-DNV3N2  product vidoe ==> Here

Acrosser had committed its valuable resources to further develop its advanced network product lines. Furthermore, Acrosser is now working directly with Intel, as part of Intel IoT Solutions Alliance, in order to be able to offer its customers first-to-market services, the latest technologies, and solutions in a timely manner. As a member of Intel IoT Solutions Alliance, Acrosser is able to directly obtain valuable resources in providing high quality and stable performance products/solutions to its customers, vis-à-vis non-IoT-Alliance-members.

For pricing and availability, please send your inquiry at http://www.acrosser.com/inquiry.html

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Fanless embedded system, mini itx board, Network Server Hardware,

PC 104 single board computer, car pc,

Acrosser is able to directly obtain valuable resources in providing high quality and stable performance products/solutions to its customers, vis-à-vis non-IoT-Alliance-members.

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acrosser Technology latest network appliance, AND-DNV3N2, which equipped with Intel® Atom C3558 Denverton-NS Platform and 2x SO-DIMM DDR4, 6x GbE, 2x USB 3.0, 2x Mini PCIe(One support SIM card socket),1x 2.5″ SSD and TPM 2.0 for a secure cryptoprocessor. This optimized system design allows network systems to function in a small footprint and form factor. In this particular size, the AND-DNV3N2 is a great alternative for the budget-conscious buyers. This cost-effective network security appliance can offer stable performance with low power consumption; and is suitable in multiple security applications including: network intrusion prevention, content filtering, data leak prevention, VPN, unified threat management (UTM) and SD-WAN solutions.

Major AND-DNV3N2 Specification:
1.Intel® Atom C3558 Denverton-NS Platform
2. 4-Core SoC
3. 2x SO-DIMM DDR4
4. 6x GbE, 2x USB 3.0
5. 2x Mini PCIe, One support SIM card socket
6. 1x 2.5″ SSD,
7. TPM 2.0

AND-DNV3N2  product vidoe ==> Here

Acrosser had committed its valuable resources to further develop its advanced network product lines. Furthermore, Acrosser is now working directly with Intel, as part of Intel IoT Solutions Alliance, in order to be able to offer its customers first-to-market services, the latest technologies, and solutions in a timely manner. As a member of Intel IoT Solutions Alliance, Acrosser is able to directly obtain valuable resources in providing high quality and stable performance products/solutions to its customers, vis-à-vis non-IoT-Alliance-members.

For pricing and availability, please send your inquiry at http://www.acrosser.com/inquiry.html

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Please visit us @ the following social media:

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Network Application, COM Express, car pc, Embedded pc, Embedded board,

Steering the embedded market

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MOST150 enables the use of a higher bandwidth of 150 Mbps, an isochronous transport mechanism to support extensive video applications, and an embedded Ethernet channel for efficient transport of IP-based packet data. It succeeds in providing significant speed enhancements and breakthroughs while keeping  In-Vehicle computers to costs down.

It succeeds in providing significant speed enhancements and breakthroughs while keeping costs down. The new Intelligent Network Interface Controller (INIC) architecture complies with Specification Rev. 3.0 and expands the audio/video capability for next generation automotive infotainment devices such as Head Units, Rear Seat Entertainment, Amplifiers, TV-Tuners and Video Displays.

refer to: http://embedded-computing.com/news/most150-series-adoption/

Industrial pc and embedded computer

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In all, inevitably, the embedded computer types of processors that will succeed in the future will be the SoCs that provide hardware-accelerated functions. It’s the only way that applications will be able to meet their performance-power budgets. In other words, with homogeneous SMP devices, the embedded computer performance gained by increased core count is not scalable. For example, the more cores that share a common bus structure, the more that each core must compete for memory bandwidth. This problem can be alleviated by designing chips that divide cores into clusters, where each cluster can operate autonomously if necessary.

What plans does the EEMBC have to expand its offerings in the future, and how can the industry get involved?

refer to: http://embedded-computing.com/articles/moving-qa-markus-levy-founder-president-eembc/

 

The attachment between embedded computers and Intel processor

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The 4th generation Intel® Core™ processors serve the embedded computing space with a new microarchitecture which Kontron will implement on a broad range of embedded computing platforms.  Beside a 15% increased CPU performance especially the graphics has improved by its doubled performance in comparison to solutions based on the previous generation processors. At the same  embedded computing , the thermal footprint has remained practically the same or has even shrunk.

Based on the 22 nm Intel® 3D processor technology already used in the predecessor generation, the processors, formerly codenamed ‘Haswell’, have experienced a performance increase which will doubtlessly benefit applications.

With improved processing and graphics performance as well as energy efficiency and broad scalability, the 4th generation Intel® Core™ processors with its new microarchitecture provide an attractive solution for a broad array of mid-range to high-end embedded applications in target markets such as medical,  embedded computing, industrial automation, infotainment and military.

refer to: http://embedded-computing.com/white-papers/white-intelr-coretm-processors/

Future blueprint for medical embedded SBC

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“If it is a mobile application with low to single board computer performance requirements, then Qseven is the right choice,” says Christian Eder, Marketing Manager at congatec AG headquartered in Deggendorf, Germany (www.congatec.com). “Medical systems typically require special functionalities such as ultrasonic control or high levels of isolation in order to protect patients in case of a malfunction. Standard SBCs typically do not feature that. The logical consequence is to create a custom carrier board that takes all specific functionalities and complete it with a standard COM. Once single board computer is certified, it is quite easy to upgrade or scale to other CPUs while the certification remains or just needs to be updated. This provides a lot of freedom to choose the best-fitting CPU and graphics for a given application.” This is just one example of why telehealth strategies are poised to revolutionize medicine. Telehealth not only provides quick access to specialists, but can also remotely monitor patients and reduce clinical expenses. Many of the systems needed to realize these benefits will operate on the edge, and require technology with the portability and price point of commercial mobile platforms, as well as the flexibility to perform multiple functions securely and in real time. All of this must be provided in a package that can meet the rigors of certification and scale over long lifecycle deployments.

refer to: http://smallformfactors.com/articles/qseven-coms-healthcare-mobile/

DRAM failure prevention from solution support

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An analysis of the failure modes of DRAM in memory embedded modules has determined that DRAM components with suboptimal reliability tend to fail during the first three months of use. As newer DRAMs advance to smaller process geometries, there can be a greater risk for chips that contain weak bits (a microscopic defect in an individual cell). This is not enough to cause a DRAM failure outright, but could exhibit a single-bit error within weeks after initial field operation begins. Using Test During Burn-In (TDBI) helps eliminate any potential early failures and improve the overall reliability of memory products. Although most DRAM chips undergo a static burn-in at the chip level, TDBI offers a more comprehensive testing approach that implements a 24-hour burn-in test at the module level while dynamically running and checking test patterns as the module is performing under stress conditions. Studies conducted by various memory embedded manufacturers show that using TDBI chambers can reduce early failures by up to 90 percent.

refer to: http://embedded-computing.com/articles/ruggedization-memory-module-design/

Creating the Raspberry Pi credit card sized

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Embedded PC, in vehicle PC, Industrial PC

 

The initial goal in creating the Raspberry Pi credit card sized, Linux-based Single Board Computer (SBC) – targeted primarily at education – was to develop a response to the decline of students engaging with computer science and related engineering disciplines. Our desire was to reverse the trend of children becoming consumers rather than creators. The following case study follows the hardware development process from an early failure, initial prototypes, and through to the finished production design.
Over recent years there has been an increasing trend for children to be consumers of digital content rather than be future creators or engineers. This trend is driven by manufacturers looking to provide a seamless experience for target customers on a variety of electronic platforms, from gaming consoles to tablets and laptop computers. As a result, access to raw I/O has become restricted. Similarly, any packaged provision of a programming environment is an anathema to the products’ commercial goals.  ……..

refer to :http://embedded-computing.com/articles/case-card-sized-sbc/