Service Dynamics Products & Services

Service Dynamics

The primary objective of a service company should be to focus on the development a system solution that is uniquely suited to the idiosyncrasies of the client’s business without being tethered by particular product solution offerings. A big part of this is the ability to deploy technologies from appropriate sources using integration and engineering skills to achieve a superior result for the client. Service businesses need to have effective and refined project, personnel, and quality management systems. The growth and effectiveness of these businesses is directly related to adding and managing smart people and this is a unique business proficiency mastered by successful service organizations. Pure service businesses have an advantage of successfully maintaining alliances with a range of product vendors that cannot be logically achieved by product vendors who provide services. This separation positions a pure service business to use best of breed and get the most out of vendors. For comparison, consider you are a smartphone user and the only place to get apps was your phone hardware vendor.

Inherent Conflict

The dynamics of a service business and innovative product business are dramatically different. Established product companies tend to emphasize the practices and culture they know best when they move into services. The tendency is to find synergies based on their products that become the recommended solutions for customers. Additionally, it can be more difficult for a product company who provides services to be the champion for the customer when there is a problem with the product being implemented.

Ideal Product Company Focus

I believe that product companies should always be striving to eliminate implementation and operations labor with improved and innovative automation technology. There is an inherent conflict by having a company that provides services and products.

refer to:http://www.automation.com/portals/factory-discrete-automation/can-automation-vendors-serve-two-masters-products-services

Acrosser unveils its ultra slim fanless embedded system with 3rd generation Intel core i processor

acrosser Technology Co. Ltd, a world-leading industrial and embedded computer designer and manufacturer, announces the new AES-HM76Z1FL embedded system. AES-HM76Z1FL, acrosser’s latest industrial endeavor, is surely a FIT under multiple circumstances. Innovation can be seen in the new ultra slim fanless design, and its Intel core i CPU can surely cater for those seeking for high performance. Therefore, these 3 stunning elements can be condensed as “F.I.T. Technology.” (Fanless, Intel core i, ultra Thin)

The heat sink from the fanless design provides AES-HM76Z1FL with great thermal performance, as well as increases the efficiency of usable space. The fanless design provides dustproof protection, and saving the product itself from fan malfunction. AES-HM76Z1FL has thin client dimensions, with a height of only 20 millimeters (272 mm x183 mm x 20 mm). This differs from most embedded appliances, which have a height of more than 50 millimeters.

The AES-HM76Z1FL embedded system uses the latest technology in scalable Intel Celeron and 3rd generation Core i7/i3 processors with a HM76 chipset. It features graphics via VGA and HDMI, DDR3 SO-DIMM support, complete I/O such as 4 x COM ports, 3 x USB3.0 ports, 8 x GPI and 8 x GPO, and storage via SATA III and Compact Flash. The AES-HM76Z1FL also supports communication by 2 x RJ-45 gigabit Ethernet ports, 1 x SIM slot, and 1 x MinPCIe expansion socket for a 3.5G or WiFi module.

Different from most industrial products that focus on application in one specific industry, the AES-HM76Z1FL provides solutions for various applications through the complete I/O interfaces. Applications of the AES-HM76Z1FL include: embedded system solutions, control systems, digital signage, POS, Kiosk, ATM, banking, home automation, and so on. It can support industrial automation and commercial bases under multiple circumstances.

Key features:
‧Fanless and ultra slim design
‧Support Intel Ivy Bridge CPU with HM76 chipset
‧2 x DDR3 SO-DIMM, up to 16GB
‧Support SATA III and CF storage
‧HDMI/VGA/USB/Audio/GPIO output interface
‧Serial ports by RS-232 and RS-422/485
‧2 x GbE, 1 x SIM, and 1 x MiniPCIe(for3G/WiFi)

Product Information:
http://www.acrosser.com/Products/Embedded-Computer/Fanless-Embedded-Systems/AES-HM76Z1FL/Intel-Core-i3/i7-AES-HM76Z1FL.html

Contact us:
http://www.acrosser.com/inquiry.html

Empowering high-performance automation for an increasingly connected world

Beyond this, the modular COM Express approach allows users the flexibility to deliver application-specific performance and power at an appropriate price level (Figure 1). For instance, a quad core i7-based processor module can be used on a specific carrier board for a high-value, high-criticality, high-performance application – while the same carrier board, with the same features and I/O functionality, can be deployed for a lower value, less critical, less demanding application with a lower-performance VIA Nano processor-based COM Express module; this results in lower development cost and faster time to market.

A modern locomotive is a perfect use case for this flexibility. There are nearly a dozen computer processors in today’s locomotives. While the processing requirements for these computers are different, most of them have similar I/O requirements. Using the same or a similar carrier board with different COM Express modules based upon the appropriate level of processor power for the application, depending on its profile, allows for price/performance balance.

The advantage of this level of modularity extends well beyond the initial deployment, however. In the longer term, upgrading the level of performance is simply a matter of replacing the processor module – not the entire subassembly. This saves money, and minimizes unforeseen impact on the way in which the module as a whole interacts with its surroundings.

In the locomotive example mentioned, the COM Express processor module can be upgraded without affecting the connection to the engine I/O residing on the carrier board – reducing costly and time-consuming recertification and testing. The modularity of COM Express gives a whole new meaning to “technology insertion.”

refer to:http://industrial-embedded.com/articles/rugged-increasingly-connected-world/

Transitioning to DO-178C and ARP4754A for UAV software development using model-based design

With the FAA and EASA adopting aviation standards such as DO-178C and ARP4754A, UAV software developers should familiarize themselves with these standards, particularly when transitioning to model-based design.

Few applications place more importance on verification, or prescribe more process guidance, than aviation. The FAA and its European equivalent, EASA, provide guidance using standards such as ARP4754 for aircraft systems and DO-178B for flight software. These standards are often used outside of civil aviation, in whole or in part, for applications including military aircraft and land vehicles. Adoption for UAV programs is rapidly growing because of the FAA’s recent decision to require UAS and OPA certification via FAA Order 8130.34A. UAV systems are heterogeneous, and not restricted just to flight software. Therefore, other standards are used such as DO-254 for hardware and DO-278 for ground and space software.

refer to:
http://mil-embedded.com/articles/transitioning-do-178c-arp4754a-uav-using-model-based-design/