The future of Android in vehicles

Android has its share of benefits and challenges when it comes to automotive infotainment systems. One such challenge is that of the emergence of mixed-criticality systems comprising both infotainment and safety-/security-critical systems, enabled by high-performance multicore processors. To face this challenge: Try virtualization.

Android represents a compelling choice for automotive Embedded Systems. As the most popular and fastest-growing mobile Operating System (OS) – comprising two-thirds of worldwide smartphone shipments – automotive OEMs see Android as the means to provide the best possible multimedia experiences. Android provides standardized interfaces for accelerated graphics, audio, wireless networking, Bluetooth technology, USB, and more, enabling applications to easily harness the power of these hardware facilities. OEMs see Android as a means of leveraging consumers’ familiarity with mobile devices to improve the automotive experience.

refer to:http://embedded-computing.com/articles/the-future-android-vehicles/

The Reliable Software Developers’ Conference – UK, May 2014

Technology event organiser Energi Technical has announced that it will be launching “The Reliable Software Developers’ Conference”, scheduled for May 2014.

This one-day conference will provide an important forum for engineers and developers working in the development of safety critical systems and high availability systems. It is expected to attract software developers working in such industries as automotive, railway systems, aerospace, bankingmedical and energy. www.rsd-conference.co.uk

“In recent years, software has become so complex that ensuring safety and reliability is now a major challenge,” said Richard Blackburn, Event Organiser. “Many systems now have millions of lines of code and will handle enormous amounts of data. Further to this, modern computer based systems will make millions of decisions every second and also have to be immune to interference and unpredictable events. This event will look at the MISRA coding standards, debug tools and software testing tools that are available to assist software programmers and engineers seeking to develop reliable and safety critical
systems.”

The Reliable Software Developers’ Conference will be co-located with the 2014 UK Device Developers’ Conference. Both will be a one-day conference to be run in Bristol, Cambridge, Northern England and Scotland on May 20th, May 20rd, June 3rd and June 5th.

Delegates attending either event will have the opportunity to sit in on technical presentations and ½ day technical workshops and a attend a vendor exhibition of tools and technology for the development of real-time and embedded systems. www.device-developer-conference.co.uk

“Advanced Debug Tools, Code Test, Version Control, Verification Tools and Software Standards have been a growing feature of recent conferences, so it made sense to create a dedicated event,” said Richard. “There will be a lot expertise available to delegates, and the chance to meet a broad range of vendors of test technologies and tools, all under one roof.”

Developed in collaboration with MISRA (Coding Standards), the Reliable Software Developers’ Conference will feature a number of presentations in the morning, followed by a half-day technical workshop in the afternoon. The presentations will be free and open to delegates of both Conferences, but the half-day workshops will be subject to a charge of £75. Delegates will learn about developments in coding standards, test and verification tools and best practices and it will also be an opportunity to meet with many industry experts.

Refer to:http://embedded-computing.com/news/the-uk-may-2014/

Acrosser wish you Happy Holidays and a very prospective 2014 coming soon!

As we near the end of 2013, acrosser would like to send you our warmest New Year’s wishes! We wish you and your family health, comfort, and prosperity this holiday season.

We also thank you for keeping up with our latest products, sending us inquiries, and choosing our products for your integrated solution! In 2014, we hope you will continue to choose Acrosser. We look forward to assisting you and your company in becoming the leader in your vertical market, and building a win-win relationship together.

And don’t forget about our star product, AES-HM76Z1FL, and its upcoming Product Testing Event in January! Remember to mark your calendar, since Acrosser is lending the product for free only to selected participants! Please stay tuned for more event information in early January!

With your continuous dedication and our commitment to quality, Acrosser is always motivated to make your embedded idea a reality!

 

Product Information:
http://www.acrosser.com/Products/Embedded-Computer/Fanless-Embedded-Systems/AES-HM76Z1FL/Intel-Core-i3/i7-AES-HM76Z1FL.html

Contact us:
http://www.acrosser.com/inquiry.html

Comprehensive customization for network appliances: meet our rackmount and micro box!

acrosser Technology, a world-leading network communication designer and manufacturer, introduces two network appliances that deliver great performance and protection while simplifying your network. Each product has its own target market and appeals to a unique audience.

Acrosser’s ANR-IB75N1/A/B serves as an integrated Unified Threat Management (UTM) device that covers all of your networking security needs. Featuring a 3rd generation Intel Core i processor, increased processing throughput is easily made. For integration with information security systems, the device also features functions such as anti-virus, anti-spam, fire wall, intrusion detection, VPN and web filtering, in order to provide complete solutions to meet the demands of various applications.

Key features of the ANR-IB75N1/A/B include:
‧Support for LGA1155 Intel® Core ™ i7/i5/i3 processor / Pentium CPU
‧Intel B75 Chipset
‧2 x DDRIII DIMM, up to 16GB memory.
‧2 x Intel 82576EB Fiber ports
‧8 x Intel 82574L 10/100/1000Mbps ports
‧Two pairs LAN ports support bypass feature (LAN 1/2 + LAN 3/4)
‧LAN bypass can be controlled by BIOS and Jumper
‧CF socket, 2 x 2.5” HDD, 1 x SATA III, 1 x SATA II
‧Console, VGA (pinhead), 2 x USB 3.0 (2 x external)
‧Support boot from LAN, console redirection
‧Equipped with 80 Plus Bronze PSU to decrease CO2 dissipation and protect our environment
‧LCM module to provide user-friendly interface
‧Standard 1U rackmount size

As for our micro box, the AND-D525N2 provides more possibilities for different applications due to its small form factor (234mm*165mm*44mm). Aside from its space-saving design, the other 3 major features of the AND-D525N2 are its high performance, low power consumption and competitive price. Please send us your inquiry via our website (http://www.acrosser.com/inquiry.html), or simply contact your nearest local sales location for further information.

Key features of the AND-D525N2 include:
‧Intel Atom D525 1.86GHz
‧Intel ICH8M Chipset
‧x DDR3 SO-DIMM up to 4GB
‧1 x 2.5 inch HDD Bay, 1 x CF socket
‧4 x GbE LAN, Realtek 8111E
‧2 x USB2.0
‧2 x SATA II
‧1 x Console
‧1 x MiniPCIe socket

Besides In addition to these two models, Acrosser also provides a wide selection of network security hardware. With more than 26 years of rich industry experience, Acrosser has the ODM/OEM ability to carry out customized solutions, shortening customers’ time-to-market and creating numerous profits.

For all networking appliances product, please visit:
http://www.acrosser.com/Products/Networking-Appliance.html

Product Information – ANR-IB75N1/A/B:
http://www.acrosser.com/Products/Networking-Appliance/Rackmount/ANR-IB75N1/A/B/Networking-Appliance-ANR-IB75N1/A/B.html

Product Information – AND-D525N2:
http://www.acrosser.com/Products/Networking-Appliance/MicroBox/AND-D525N2/ATOM-D525-AND-D525N2.html

Contact us:
http://www.acrosser.com/inquiry.html

INDUSTRIAL ETHERNET GROWING IN CHINA

December 5, 2013 – The Chinese market for industrial Ethernet & Fieldbus Technologies grew by 18 million nodes in 2012. More than 3 million nodes used Ethernet and the remainder used Fieldbus technology.

Although Fieldbus has a large base of new connected nodes in China, the usage of Fieldbus is not as common as in developed countries such as Germany or the United States. This is mainly because Chinese customers are encountering networking technology much later than those developing countries.

However, the growing speed of Ethernet is quite considerable in China and we think it is a great opportunity for Chinese customers to upgrade their automation system under current market condition. Customers will just jump from old Fieldbus Technologies direct to Ethernet now and actually many of them are doing right now. The Chinese market is currently engaged in extensive upgrading and new infrastructure construction, and that will require a great deal of Ethernet applications.

In China, international brands are quite influential. This is also true for industrial networking protocols because most of them having their supporting companies. For example, the most popular Fieldbus protocols in China are PROFIBUS and CC-Link, which are developed and promoted by Siemens and Mitsubishi separately, which command large market share in China.

On the other hand, some open protocols also have a large number of nodes connected, and the most representative ones are CANOpen, Modbus and HART. However, all three protocols don’t deliver strong functionality, and they are more likely to be used in low-end applications for easy connections.

With the upgrading of old facilities and the construction of new plants in China, customers also are being compelled to upgrade their systems using Ethernet. However, this move will not only be implemented by the customers, but also by the industrial automation vendors as well.

Most protocols have Ethernet variants. Because of this, many Fieldbus users will turn to the Ethernet of the application, for example, PROFIBUS to PROFINET, CC-Link to CC-Link IE. And the new automation products will also support those new Ethernet connections.

refer to:http://www.automation.com/portals/industrial-networks-field-buses/industrial-ethernet-growing-in-china

High Computing Performance for All Applications- F.I.T. Technology

The demand for computing performance in the IPC market continues to become stronger as the IT field advances. acrosser’s new AES-HM76Z1FL has been designed to meet these demands.
The F.I.T. Technology used to build this new product reflects its 3 major features: fanless design, Intel core i processor and ultra thin frame. The fanless design not only reduces the risk of exposure to air dust, but also prevents fan-malfunction. With a height of less than 0.8 inches, AES-HM76Z1FL’s slim design makes itself FIT into every application.
As its structure and output interface show, AES-HM76Z1FL provides a wide range of choices, from HDMI, VGA, USB, and audio to GPIO output interfaces that suit almost all industries. For wireless communication needs, the AES-HM76Z1FL has a mini-PCle expansion slot which provides support on both 3.5G and WiFi.
Another fascinating feature of the AES-HM76Z1FL is its ease of installation for expansions. By disassembling the bottom cover, expansions such as CF cards, memory upgrades and mini-PCIe can be easily complete without moving the heat sink. Moreover, Acrosser adopts 4 types of CPU (Intel Core i7/i3, Intel Celeron 1047UE/927UE) for AES-HM76Z1FL, allowing it to satisfy the scalable market demands of different applications.
In conclusion, the AES-HM76Z1FL is truly a well-rounded product designed for diverse applications. To promote our star product AES-HM76Z1FL, Acrosser will launch a product testing campaign starting in January, 2014. Acrosser will provide selected applications with the new AES-HM76Z1FL for one month, and it’s free! For more detailed information, please stay tuned for our press release, or leave us an inquiry on our website at www.acrosser.com!Product Information:
http://www.acrosser.com/Products/Embedded-Computer/Fanless-Embedded-Systems/AES-HM76Z1FL/Intel-Core-i3/i7-AES-HM76Z1FL.html

Service Dynamics Products & Services

Service Dynamics

The primary objective of a service company should be to focus on the development a system solution that is uniquely suited to the idiosyncrasies of the client’s business without being tethered by particular product solution offerings. A big part of this is the ability to deploy technologies from appropriate sources using integration and engineering skills to achieve a superior result for the client. Service businesses need to have effective and refined project, personnel, and quality management systems. The growth and effectiveness of these businesses is directly related to adding and managing smart people and this is a unique business proficiency mastered by successful service organizations. Pure service businesses have an advantage of successfully maintaining alliances with a range of product vendors that cannot be logically achieved by product vendors who provide services. This separation positions a pure service business to use best of breed and get the most out of vendors. For comparison, consider you are a smartphone user and the only place to get apps was your phone hardware vendor.

Inherent Conflict

The dynamics of a service business and innovative product business are dramatically different. Established product companies tend to emphasize the practices and culture they know best when they move into services. The tendency is to find synergies based on their products that become the recommended solutions for customers. Additionally, it can be more difficult for a product company who provides services to be the champion for the customer when there is a problem with the product being implemented.

Ideal Product Company Focus

I believe that product companies should always be striving to eliminate implementation and operations labor with improved and innovative automation technology. There is an inherent conflict by having a company that provides services and products.

refer to:http://www.automation.com/portals/factory-discrete-automation/can-automation-vendors-serve-two-masters-products-services

Acrosser unveils its ultra slim fanless embedded system with 3rd generation Intel core i processor

acrosser Technology Co. Ltd, a world-leading industrial and embedded computer designer and manufacturer, announces the new AES-HM76Z1FL embedded system. AES-HM76Z1FL, acrosser’s latest industrial endeavor, is surely a FIT under multiple circumstances. Innovation can be seen in the new ultra slim fanless design, and its Intel core i CPU can surely cater for those seeking for high performance. Therefore, these 3 stunning elements can be condensed as “F.I.T. Technology.” (Fanless, Intel core i, ultra Thin)

The heat sink from the fanless design provides AES-HM76Z1FL with great thermal performance, as well as increases the efficiency of usable space. The fanless design provides dustproof protection, and saving the product itself from fan malfunction. AES-HM76Z1FL has thin client dimensions, with a height of only 20 millimeters (272 mm x183 mm x 20 mm). This differs from most embedded appliances, which have a height of more than 50 millimeters.

The AES-HM76Z1FL embedded system uses the latest technology in scalable Intel Celeron and 3rd generation Core i7/i3 processors with a HM76 chipset. It features graphics via VGA and HDMI, DDR3 SO-DIMM support, complete I/O such as 4 x COM ports, 3 x USB3.0 ports, 8 x GPI and 8 x GPO, and storage via SATA III and Compact Flash. The AES-HM76Z1FL also supports communication by 2 x RJ-45 gigabit Ethernet ports, 1 x SIM slot, and 1 x MinPCIe expansion socket for a 3.5G or WiFi module.

Different from most industrial products that focus on application in one specific industry, the AES-HM76Z1FL provides solutions for various applications through the complete I/O interfaces. Applications of the AES-HM76Z1FL include: embedded system solutions, control systems, digital signage, POS, Kiosk, ATM, banking, home automation, and so on. It can support industrial automation and commercial bases under multiple circumstances.

Key features:
‧Fanless and ultra slim design
‧Support Intel Ivy Bridge CPU with HM76 chipset
‧2 x DDR3 SO-DIMM, up to 16GB
‧Support SATA III and CF storage
‧HDMI/VGA/USB/Audio/GPIO output interface
‧Serial ports by RS-232 and RS-422/485
‧2 x GbE, 1 x SIM, and 1 x MiniPCIe(for3G/WiFi)

Product Information:
http://www.acrosser.com/Products/Embedded-Computer/Fanless-Embedded-Systems/AES-HM76Z1FL/Intel-Core-i3/i7-AES-HM76Z1FL.html

Contact us:
http://www.acrosser.com/inquiry.html

Empowering high-performance automation for an increasingly connected world

Beyond this, the modular COM Express approach allows users the flexibility to deliver application-specific performance and power at an appropriate price level (Figure 1). For instance, a quad core i7-based processor module can be used on a specific carrier board for a high-value, high-criticality, high-performance application – while the same carrier board, with the same features and I/O functionality, can be deployed for a lower value, less critical, less demanding application with a lower-performance VIA Nano processor-based COM Express module; this results in lower development cost and faster time to market.

A modern locomotive is a perfect use case for this flexibility. There are nearly a dozen computer processors in today’s locomotives. While the processing requirements for these computers are different, most of them have similar I/O requirements. Using the same or a similar carrier board with different COM Express modules based upon the appropriate level of processor power for the application, depending on its profile, allows for price/performance balance.

The advantage of this level of modularity extends well beyond the initial deployment, however. In the longer term, upgrading the level of performance is simply a matter of replacing the processor module – not the entire subassembly. This saves money, and minimizes unforeseen impact on the way in which the module as a whole interacts with its surroundings.

In the locomotive example mentioned, the COM Express processor module can be upgraded without affecting the connection to the engine I/O residing on the carrier board – reducing costly and time-consuming recertification and testing. The modularity of COM Express gives a whole new meaning to “technology insertion.”

refer to:http://industrial-embedded.com/articles/rugged-increasingly-connected-world/

Transitioning to DO-178C and ARP4754A for UAV software development using model-based design

With the FAA and EASA adopting aviation standards such as DO-178C and ARP4754A, UAV software developers should familiarize themselves with these standards, particularly when transitioning to model-based design.

Few applications place more importance on verification, or prescribe more process guidance, than aviation. The FAA and its European equivalent, EASA, provide guidance using standards such as ARP4754 for aircraft systems and DO-178B for flight software. These standards are often used outside of civil aviation, in whole or in part, for applications including military aircraft and land vehicles. Adoption for UAV programs is rapidly growing because of the FAA’s recent decision to require UAS and OPA certification via FAA Order 8130.34A. UAV systems are heterogeneous, and not restricted just to flight software. Therefore, other standards are used such as DO-254 for hardware and DO-278 for ground and space software.

refer to:
http://mil-embedded.com/articles/transitioning-do-178c-arp4754a-uav-using-model-based-design/